JLR Heigh Prep

 Understanding the P.S. 

1.
BACKGROUND automotive industry
    
    Ev's  ( Electric Vehicles ):
        Revolutions : 1. Autonomous Driving
                              2. Connected Cars
                                3. Shared Mobility
                                4. Software Defined Vehicles
        Complex, intelligent and connected Vehicles
                            1. because of integration of advanced electronics and software
                               2. massive lines of code , 100 million lines of code 
                               3. Rising cost of Electronics : accounts 40% of the cost increased 10 times
        Need Of Semiconductor In Automotive Space
                            1. Semiconductor is crucial for advancement of electronic system
                              2. So partnership with semiconductor industries    
                                       * Companies like JLR ( Jaguar Land Rover ) connecting with
                                                1. NVIDIA for ADAS( Advanced Derived Assistant System )
                                                2. Wolfspeed for Silicon Carbide (SiC) chips used in Ev's to improve power efficiency and increase driving range 
                                                
NOTES : similar to smartphone industries transformation in automotive industry is often likened to what happened in smartphone industries
    i.e. their disruption and growth is expected to come by rapid advancement of high-performance semiconductors


2. UNDERSTANDING THE TREND IN AUTOMOTIVE INDUSTRY
    a.) More features in cars :
            Automakers(OEMs) are adding more and more features to their vehicles, which requires high- performance component . Means  requirements of a lot of powerful processors.
             Moore's law given us powerful processors by making transistor smaller
    b.) Centralized Vehicle Computer :
            Automakers are moving towards a centralized vehicle architecture. Instead of multiple smaller computers, they are using one or two very powerful high-performance computers in cars. These computers are incredibly fast.
    c.) Software Defined Vehicles (SDV) :
             OEMs are creating Software Defined Vehicles, where many car features are controlled and updated through software during the car's lifetime. This involves reducing the amount of hardware in the car and using cloud-based technologies.     
            ( example : we can remove hardware required to put gear manually and use a software instead )


NOTES : IBM and TSMC have developed chips with transistors that are incredibly small, with billions transistors on a chip the size of a fingernail.
IBM's 2-nanometer (nm) chip technology puts 50 billion transistors, each the size of
roughly five atoms

     SOA ( Service -Oriented Architecture ) : Approach where software components are designed to be reusable and loosely coupled . These services can be independently developed and deployed. They communicate each other over a network.
            it breaks complex system into smaller , manageable services to work together and provide functionality.
        Example : payment processing service , order processing services in Amazon.

  Containerization : Its a technology allows you to package an application and its dependencies, including libraries and runtime into a single , lightweight , and consistent unit called container.
            provides a consistent environment for running application, making easier to deploy and manage software across different systems and environments .
        Example : such as Docker containers. ( these containers include service code ..)

  Orchestration : refers to automated management of coordination of containers in a cluster or distributed environment.
            Example : 1. Kubernetes help manage the deployment ,scaling  and load balancing of containers , to run efficiently and reliably.
                                                                    
   Data Processing : capacity of system to handle, manipulate and analyze data.
            Example : big data analytics ,  Real-time Recommendation ,Order processing
           
Together
    Implementing a software architecture where different services are designed to work together in a modular and loosely coupled manner.
    Using container technology to package and deploy these services, ensuring that they are consistent and portable across different environments.
    Automating the management and scaling of these containers, especially in large , distributed systems.
    The system's ability to efficiently process and analyze data, which is often a critical requirement in modern software architectures,

TOPS stands for "Tera Operations Per Second," which is a measure of the computing performance for AI (Artificial Intelligence) and machine learning tasks. DMIPS stands for "Dhrystone Million Instructions Per Second," which is a measure of general computing performance. 

 

3. SYSTEM ON CHIPS ADVANTAGE AND LIMITATIONS
   
    Soc's is a system-on-chip technology in automotive industry, 
    Advantages :
            1. small size : reduce physical size of the components
             2. High-performance: can perform high performance computing
             3. Enhanced Security : Increase security by reducing no. of points vulnerable to attack
             4. Low Latency: soc's provide low latency performance , which is crucial for real-time applications .
    
    Challenges :
           1. Die size vs . Tech. Adva. : feature increase the die size of soc must grow , even as process size shrink with latest technologies.
                as the rate of die size growth outpaces technological reduction in size .
            2. High Development and Manufacturing Cost:
                    Reducing the node size in semiconductor manufacturing to lower nanometers is extremely costly, with expenses increasing exponentially.
            3. Limited Suppliers of Low nm Node:
                    example : Samsung, TSMC
            4. Power consumption : High performance soc's can be power-hungry, as power is limited resource .
            5. Overheating Concerns: Compact packaging lead to overheating issues,
            6. Limited variations : Socs , due to common design, offer limited possibilities for OEM's( Original equipment manufacturers ) to differentiate their products. This make challenge for automotive manufacturer to create unique features that set their vehicles apart from competitors.
             
        IP refereed above is Intellectual property.



4. CHIPLETS: A PROMISE FOR FUTURE ?     
    Chiplets : is a technology that can replace the old SoCs design.
                     Chiplets are segmented processors
                     Specific section of the chip are manufactured as separate, individual chips.
                     Then integrated into a single package using a complex connection system.
   
    Idea behind it : To breakdown the components of a complex chip into functional blocks or parts.
    sub-elements for example :
        Graphic unit ,
        AI accelerators,
        I/O functions,
        Separate computational processor
        host of other chip function
        and various other chip functions can each be chaplets.
       
    Its more like SoCs on a module , more flexible SoCs
    
    Benefit Behind it :
        1.  creating more energy-efficient system :
                    by having  specialized chiplets , power can be allocated more efficiently , reducing energy consumption .
        2.  Shortening system development cycles : Developing and updating system will become
            more faster ,
            more flexible ,
        3. Reducing Cost - increasing efficiency:      
            more efficient( working on specific part that have need to improvement ) ,
            more cheaper ( instead or updating whole chip-set  we need to work on particular parts that have need at the particular field )
        4. High Scalability: Chiplets allow for the integration of multiple dies (individual chips) into a single package. This scalability enables the assembly of complex systems with different functionalities in a single package.
        5 Flexibility in Process Node Size: Not all components benefit from a smaller process node size. Chiplets provide the flexibility to use different process node sizes for various functions within the same package. For example, logic components can be on a smaller 3 nm process node, while analog components can be on a 12 nm node, which can help save costs.
        6. Customizability: Chiplets offer great flexibility in building custom packages, similar to assembling Lego blocks. This is in contrast to traditional SoCs, where the components come pre-integrated, and customization options are limited.
        7. Easy Component Updates: CPU, GPU (Graphics Processing Unit), and NPU (Neural Processing Unit) have different update cycles. With chiplets, you can easily replace and upgrade GPUs and NPUs while keeping the CPU the same. This flexibility is important for staying up-to-date with rapidly evolving technologies.

5. Challenges in Chiplet Adoption in the Automotive Sector:

• Reliable Die-to-Die Communication: Ensuring efficient and reliable communication between different chiplets is a key challenge. Reliable data transfer is critical for the performance of the system.

• Latency: Achieving low latency in communication between chiplets is essential, especially for real-time applications in the automotive industry, such as autonomous driving and safety-critical systems.

• Security: Ensuring the security of data and communications within the chiplet-based system is vital to protect against potential threats or vulnerabilities
  
  
  
  

Considerations for Automotive Operating Conditions:

• The automotive industry has unique operating conditions and requirements due to its emphasis on safety and reliability:

  • Wide-Ranging Weather Conditions: Cars must operate reliably in diverse weather conditions, including heavy rain, fog, and situations with inadequate or improper lighting.

  • Extreme Temperatures: Vehicles must function flawlessly in a wide range of temperatures, from desert heat to snowy cold.

  • Network and Connectivity: Automotive systems must maintain connectivity, even in areas with poor network or connectivity coverage while en route.

  • Rough Terrain: Cars must handle rough terrain and uneven surfaces.

  • Traffic and High-Speeds: Operating in heavy traffic or at high speeds presents specific challenges.

  • Variable Loading: The weight and loading conditions of the vehicle can change, affecting the performance

6. LETS UNDERSTAND WHAT JLR IS 
   

Jaguar Land Rover (JLR):

• Ownership: JLR is a subsidiary of Tata Motors, an Indian automotive company.
• Brands: JLR includes two iconic British automotive brands: Jaguar and Land Rover.
• History: Jaguar has a long history, dating back to 1922, known for producing luxury sports cars and saloon cars. Land Rover, founded in 1948, is famous for its rugged and off-road-capable vehicles.
• Product Range: JLR produces a wide range of vehicles, including sedans, SUVs, and sports cars under the Jaguar brand, as well as a lineup of off-road and luxury SUVs under the Land Rover brand.
• Luxury and Performance: JLR vehicles are known for their luxury features, cutting-edge technology, and high-performance capabilities. They are often associated with premium and upscale automotive segments.
• Innovation: JLR has been involved in developing innovative technologies, including electric and hybrid powertrains, advanced driver assistance systems (ADAS), and connected vehicle features.
• Global Presence: JLR has a global presence, with manufacturing facilities and a network of dealerships around the world. They have a strong presence in the United Kingdom and have expanded into other key markets.
• Commitment to Sustainability: Like many other automakers, JLR has been working on making its vehicles more environmentally friendly and sustainable. They have announced plans to electrify their vehicle lineup, including the development of electric and hybrid models.
  
  
  

JLR's future

JLR is currently undergoing a major transformation. The company is investing heavily in electric vehicles, autonomous driving, and connected cars. JLR is also developing new software-defined vehicles.

In 2021, JLR announced its "Reimagine" strategy, which outlines the company's plans for the future. Reimagine focuses on three key areas:

• Electrification: JLR plans to become an all-electric luxury brand by 2025.
• Modern luxury: JLR plans to redefine modern luxury by creating vehicles that are connected, intelligent, and sustainable.
• New business models: JLR plans to develop new business models, such as subscription services and car sharing.

JLR is a leading manufacturer of luxury vehicles, and it is well-positioned for the future. The company has a strong brand presence, a global reach, and a commitment to innovation.

Some Idea From Our Ais:

 1. GPT:
            Gpt Suggestions
        Advanced Driver-Assistance Systems (ADAS):
        In-Vehicle Entertainment and Infotainment:
        Electric Vehicle (EV) Powertrain Management:
        Autonomous Driving Capabilities:
        In-Car Networking and Connectivity:
        Off-Road and All-Terrain Features:
        Customized Interior and User Experience:
        Energy Management in Hybrid Models:
        Remote Diagnostics and Maintenance:
        End-to-End Vehicle Security:
The adoption of chiplet technology should align with their overall business and innovation strategies, focusing on improving the performance, safety, and user experience of their vehicles.

2. Bard, chatsonic , koala , you.com:|
        Bard
        1. Autopilot:
        2. Infotainment:

Points to think of for thinking of idea :

1. One critical success factor for car manufacturers will be to reclaim control of their roadmaps and architectures, rather than relying too much on suppliers' strategic choices. This will require the entire ecosystem to reinvent its R&D practices and collaboration models.
2. Chiplets could enable the development of more sophisticated and reliable smart driver assistance systems.

3. what is ADAS :ADAS stands for Advanced Driver Assistance Systems. It is a suite of technologies that are designed to assist the driver in operating a vehicle safely. ADAS systems can provide warnings, alerts, and even take control of the vehicle in certain situations.

• AEB can help to prevent rear-end collisions, which are one of the most common types of accidents.
• LDW can help to prevent lane departure accidents, which can be caused by driver distraction or fatigue.
• BSM can help to prevent accidents caused by drivers changing lanes without checking their blind spots.
• ACC can help to reduce driver fatigue and improve traffic flow.
• TSR can help drivers to stay within the speed limit and avoid traffic fines.

4. Safety and collision avoidance technologies are becoming increasingly important, necessitating the development of smart driver assistance systems that can make real-time decisions.

5.Tsmc mentions :
    1. ) 3Dblox 2.0, which appears to be an open standard for 3D IC design, indicating that TSMC is actively involved in developing technologies that are relevant to chiplet-based design.
    2. )  need for collaboration in the adoption of chiplet technology.
    3. ) The collaboration with key memory partners such as Micron and Samsung Memory to advance generative AI systems through increased memory capacity aligns with the potential applications of chiplet technology, especially in AI and high-performance computing
    4.) collaboration with substrate and testing partners, focusing on productivity gains and effective testing. This reflects the importance of substrate technology and testing in chiplet-based designs, ensuring efficient integration and operation of chiplets.
    5. ) 3Dblox 2.0 and Industry Standards: The introduction of 3Dblox 2.0 and the formation of the 3Dblox Committee to create an industry-wide specification for system design with chiplets is directly relevant to the main task of the problem statement, which discusses the importance of standards for chiplet adoption.
    6. ) TSMC's role as a leader in semiconductor manufacturing and advanced packaging technology reinforces the credibility of chiplet-based innovations and advancements, aligning with the problem statement's focus on chiplets as a solution to industry challenges.